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Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
MATERIALS AND DESIGN -REIGATE- ; 52 ; 359-366
01.01.2013
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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