Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Development of Cu-Ag pastes for high temperature sustainable bonding
Development of Cu-Ag pastes for high temperature sustainable bonding
Development of Cu-Ag pastes for high temperature sustainable bonding
Hsiao, Ching-Huan (Autor:in) / Kung, Wan-Ting (Autor:in) / Song, Jenn-Ming (Autor:in) / Chang, Jing-Yao (Autor:in) / Chang, Tao-Chih (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 684 ; 500-509
01.01.2017
10 pages
Aufsatz (Zeitschrift)
Unbekannt
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Development of Cu-Ag pastes for high temperature sustainable bonding
| British Library Online Contents | 2017
| BASE | 2019
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