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    Development of Cu-Ag pastes for high temperature sustainable bonding

    New search for: Hsiao, Ching-Huan
    New search for: Kung, Wan-Ting
    New search for: Song, Jenn-Ming
    New search for: Chang, Jing-Yao
    New search for: Chang, Tao-Chih

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    Development of Cu-Ag pastes for high temperature sustainable bonding

    New search for: Hsiao, Ching-Huan
    New search for: Kung, Wan-Ting
    New search for: Song, Jenn-Ming
    New search for: Chang, Jing-Yao
    New search for: Chang, Tao-Chih

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Development of Cu-Ag pastes for high temperature sustainable bonding

    New search for: Hsiao, Ching-Huan
    New search for: Kung, Wan-Ting
    New search for: Song, Jenn-Ming
    New search for: Chang, Jing-Yao
    New search for: Chang, Tao-Chih

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Development of Cu-Ag pastes for high temperature sustainable bonding

    Contributors:

    Hsiao, Ching-Huan (author) / Kung, Wan-Ting (author) / Song, Jenn-Ming (author) / Chang, Jing-Yao (author) / Chang, Tao-Chih (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 684 ; 500-509

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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