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Large-scale flexible conductive copper-silver pattern based on direct photo-patterning via volume additive process on demand
Large-scale flexible conductive copper-silver pattern based on direct photo-patterning via volume additive process on demand
Large-scale flexible conductive copper-silver pattern based on direct photo-patterning via volume additive process on demand
Wang, Bowen (Autor:in) / Hu, Dongdong (Autor:in) / Nie, Jun (Autor:in) / Zhu, Xiaoqun (Autor:in)
MATERIALS LETTERS ; 188 ; 296-299
01.01.2017
4 pages
Aufsatz (Zeitschrift)
Unbekannt
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