Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Gueydan, Antoine (Autor:in) / Hug, Eric (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 709 ; 134-138
01.01.2018
5 pages
Aufsatz (Zeitschrift)
Unbekannt
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