Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Copper-clad or copper-clad alloy aluminum oxide ceramic substrate and preparation method thereof
The invention discloses a copper-clad or copper-clad alloy aluminum oxide ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: selecting metal copper or copper alloy powder, spraying the metal copper or copper alloy powder on the surface of the aluminum oxide ceramic substrate covered with a mask plate with the specific pattern in a molten statethrough an atmospheric plasma spraying technology, and preparing the aluminum oxide ceramic copper-clad substrate with high copper or copper alloy and aluminum oxide ceramic interface bonding strength and high conductivity by adjusting a plurality of process parameters and a plasma spray gun structure. Metal copper or copper alloy powder is directly sprayed on the aluminum oxide ceramic substrateto obtain the copper-clad ceramic substrate, and the metal copper or copper alloy powder is sprayed on the aluminum oxide ceramic substrate covered with the mask of the circuit pattern to obtain thecopper-clad circuit ceramic substrate with different patterns and high line width precision. According to the novel copper-clad or copper alloy aluminum oxide ceramic substrate and the preparation method thereof, the method is simple, rapid and large-area preparation can be realized, the cost is reduced, and the application prospect is wide.
一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法。所述制备方法选用金属铜或铜合金粉体，通过大气等离子喷涂技术将金属铜或铜合金粉体在熔融状态下喷涂在覆盖有特定图案掩模版的氧化铝陶瓷基板表面，调整诸多工艺参数和等离子体喷枪结构制备出铜或铜合金与氧化铝陶瓷界面结合强度高、电导率高的氧化铝陶瓷敷铜基板。本发明直接将金属铜或铜合金粉末喷涂在氧化铝陶瓷基板得到敷铜陶瓷基板，将金属铜或铜合金粉末喷涂在敷盖有电路图案的掩模的氧化铝陶瓷基板上，得到不同图案且线宽精度高的敷铜电路陶瓷基板。本发明是一种新的敷铜或铜合金氧化铝陶瓷基板及制备方法，该方法简单，可以实现快速、大面积制备，降低成本，具有广阔的应用前景。
Copper-clad or copper-clad alloy aluminum oxide ceramic substrate and preparation method thereof
The invention discloses a copper-clad or copper-clad alloy aluminum oxide ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: selecting metal copper or copper alloy powder, spraying the metal copper or copper alloy powder on the surface of the aluminum oxide ceramic substrate covered with a mask plate with the specific pattern in a molten statethrough an atmospheric plasma spraying technology, and preparing the aluminum oxide ceramic copper-clad substrate with high copper or copper alloy and aluminum oxide ceramic interface bonding strength and high conductivity by adjusting a plurality of process parameters and a plasma spray gun structure. Metal copper or copper alloy powder is directly sprayed on the aluminum oxide ceramic substrateto obtain the copper-clad ceramic substrate, and the metal copper or copper alloy powder is sprayed on the aluminum oxide ceramic substrate covered with the mask of the circuit pattern to obtain thecopper-clad circuit ceramic substrate with different patterns and high line width precision. According to the novel copper-clad or copper alloy aluminum oxide ceramic substrate and the preparation method thereof, the method is simple, rapid and large-area preparation can be realized, the cost is reduced, and the application prospect is wide.
一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法。所述制备方法选用金属铜或铜合金粉体，通过大气等离子喷涂技术将金属铜或铜合金粉体在熔融状态下喷涂在覆盖有特定图案掩模版的氧化铝陶瓷基板表面，调整诸多工艺参数和等离子体喷枪结构制备出铜或铜合金与氧化铝陶瓷界面结合强度高、电导率高的氧化铝陶瓷敷铜基板。本发明直接将金属铜或铜合金粉末喷涂在氧化铝陶瓷基板得到敷铜陶瓷基板，将金属铜或铜合金粉末喷涂在敷盖有电路图案的掩模的氧化铝陶瓷基板上，得到不同图案且线宽精度高的敷铜电路陶瓷基板。本发明是一种新的敷铜或铜合金氧化铝陶瓷基板及制备方法，该方法简单，可以实现快速、大面积制备，降低成本，具有广阔的应用前景。
Copper-clad or copper-clad alloy aluminum oxide ceramic substrate and preparation method thereof
一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法
PAN WEI (Autor:in) / LIU GUANGHUA (Autor:in)
28.07.2020
Patent
Elektronische Ressource
Chinesisch
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