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Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear
Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear
Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear
Wu, Lianping (Autor:in) / Yu, Wenshan (Autor:in) / Hu, Shuling (Autor:in) / Shen, Shengping (Autor:in)
International journal of plasticity ; 97 ; 246-258
01.01.2017
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11233
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