Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Size-dependent stability of stacking fault tetrahedron in coherent twin boundary bicrystal: Comparisons among Al, Ni, Cu and Ag
Size-dependent stability of stacking fault tetrahedron in coherent twin boundary bicrystal: Comparisons among Al, Ni, Cu and Ag
Size-dependent stability of stacking fault tetrahedron in coherent twin boundary bicrystal: Comparisons among Al, Ni, Cu and Ag
Wu, Lianping (Autor:in) / Yu, Wenshan (Autor:in) / Hu, Shuling (Autor:in) / Shen, Shengping (Autor:in)
Computational materials science ; 155 ; 256-265
01.01.2018
10 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear
| British Library Online Contents | 2017
Shear response of grain boundary bicrystals with a stacking fault tetrahedron
| British Library Online Contents | 2018
Shear response of grain boundary bicrystals with a stacking fault tetrahedron
| British Library Online Contents | 2018
Dynamic Twin Nucleation at Grain Boundary in Copper Bicrystal
| British Library Online Contents | 2004
Effect of coherent twin boundary and stacking fault on deformation behaviors of copper nanowires
| British Library Online Contents | 2015