Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
Pereira, Elaine Cristina (Autor:in) / Mathlakova, Lioudmila Aleksandrovna (Autor:in) / da Silva Figueiredo, André Ben-Hur (Autor:in) / Lima, Eduardo Sousa (Autor:in) / dos Santos Paula, Andersan (Autor:in) / Monteiro, Sergio Neves (Autor:in)
MATERIALS LETTERS ; 210 ; 54-57
01.01.2018
4 pages
Aufsatz (Zeitschrift)
Unbekannt
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Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
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