Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Corrigendum to "Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy" [Mater. Lett. 210 (2018) 54–57]
Corrigendum to "Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy" [Mater. Lett. 210 (2018) 54–57]
Corrigendum to "Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy" [Mater. Lett. 210 (2018) 54–57]
Pereira, Elaine Cristina (Autor:in) / Matlakhova, Lioudmila Aleksandrovna (Autor:in) / da Silva Figueiredo, André Ben-Hur (Autor:in) / Lima, Eduardo Sousa (Autor:in) / dos Santos Paula, Andersan (Autor:in) / Monteiro, Sergio Neves (Autor:in)
MATERIALS LETTERS ; 212 ; 287
01.01.2018
287 pages
Aufsatz (Zeitschrift)
Unbekannt
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| British Library Online Contents | 2018
| British Library Online Contents | 2018
Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
| British Library Online Contents | 2018
Grain ejection associated with thermocycling of Cu-Al-Ni shape memory alloy
| British Library Online Contents | 2018
| British Library Online Contents | 2018