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Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations
Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations
Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations
Ma, G.C. (Autor:in) / Fan, J.L. (Autor:in) / Gong, H.R. (Autor:in)
Computational materials science ; 152 ; 165-168
01.01.2018
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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