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Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Ma, G.C. / Fan, J.L. / Gong, H.R.

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Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Ma, G.C. / Fan, J.L. / Gong, H.R.

Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Ma, G.C. / Fan, J.L. / Gong, H.R.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Contributors:

Ma, G.C. (author) / Fan, J.L. (author) / Gong, H.R. (author)

Published in:

Computational materials science ; 152 ; 165-168

Publication date:

2018-01-01

Size:

4 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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