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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate
Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate
Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate
Lim, Ju Dy (Autor:in) / Lee, Pui Mun (Autor:in) / Rhee, Daniel Min Woo (Autor:in) / Leong, Kam Chew (Autor:in) / Chen, Zhong (Autor:in)
Applied surface science ; 355 ; 509-515
01.01.2015
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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