Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Transient temperature fields and thermal stress fields in glazing of different thicknesses exposed to heat radiation
Transient temperature fields and thermal stress fields in glazing of different thicknesses exposed to heat radiation
Transient temperature fields and thermal stress fields in glazing of different thicknesses exposed to heat radiation
Yang, Yuzhuo (Autor:in) / Chow, Cheuk Lun (Autor:in)
Construction & building materials ; 193 ; 589-603
01.01.2018
15 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
624.18
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