Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
Lanzillo, Nicholas A. (Autor:in) / Briggs, Benjamin D. (Autor:in) / Robison, Robert R. (Autor:in) / Standaert, Theo (Autor:in) / Lavoie, Christian (Autor:in)
Computational materials science ; 158 ; 398-405
01.01.2019
8 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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