Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
Suhir, Ephraim (Autor:in)
Journal of thermal stresses ; 42 ; 29-48
01.01.2019
20 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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