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Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
You, Lingyun (Autor:in) / You, Zhanping (Autor:in) / Dai, Qingli (Autor:in) / Xie, Xinfeng (Autor:in) / Washko, Sarah (Autor:in) / Gao, Junfeng (Autor:in)
Construction & building materials ; 203 ; 322-330
01.01.2019
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
624.18
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