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Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
You, Lingyun (author) / You, Zhanping (author) / Dai, Qingli (author) / Xie, Xinfeng (author) / Washko, Sarah (author) / Gao, Junfeng (author)
Construction & building materials ; 203 ; 322-330
2019-01-01
9 pages
Article (Journal)
English
DDC:
624.18
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