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Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers
Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers
Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers
Ma, Y.J. (Autor:in) / Cai, Y.P. (Autor:in) / Wang, G.J. (Autor:in) / Cui, M.J. (Autor:in) / Sun, C. (Autor:in) / Cao, Z.H. (Autor:in) / Meng, X.K. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 742 ; 751-759
01.01.2019
9 pages
Aufsatz (Zeitschrift)
Unbekannt
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