Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers: Fid-Bau Portal

Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers

Ma, Y.J. / Cai, Y.P. / Wang, G.J. / Cui, M.J. / Sun, C. / Cao, Z.H. / Meng, X.K.

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Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers

Ma, Y.J. / Cai, Y.P. / Wang, G.J. / Cui, M.J. / Sun, C. / Cao, Z.H. / Meng, X.K.

Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers

Ma, Y.J. / Cai, Y.P. / Wang, G.J. / Cui, M.J. / Sun, C. / Cao, Z.H. / Meng, X.K.

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Document information

Title:

Enhanced thermal stability by heterogeneous interface and columnar grain in nanoscale Cu/Ru multilayers

Contributors:

Ma, Y.J. (author) / Cai, Y.P. (author) / Wang, G.J. (author) / Cui, M.J. (author) / Sun, C. (author) / Cao, Z.H. (author) / Meng, X.K. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 742 ; 751-759

Publication date:

2019-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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