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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Chemical-Mechanical Planarization of Semiconductor Materials
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed
Chemical-Mechanical Planarization of Semiconductor Materials
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed
Chemical-Mechanical Planarization of Semiconductor Materials
Oliver, Michael R. (Autor:in)
2004
Online-Ressource (XI, 428 p)
digital
Campusweiter Zugriff (Universität Hannover). - Vervielfältigungen (z.B. Kopien, Downloads) sind nur von einzelnen Kapiteln oder Seiten und nur zum eigenen wissenschaftlichen Gebrauch erlaubt. Keine Weitergabe an Dritte. Kein systematisches Downloaden durch Robots.
Buch
Elektronische Ressource
Englisch
DDC:
620.11
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