Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microelectronic-interconnection design
Evaluation of materials and construction of microminiaturized component design; design parameters for ceramic wafers, microsoldered connections and selection of materials.
Microelectronic-interconnection design
Evaluation of materials and construction of microminiaturized component design; design parameters for ceramic wafers, microsoldered connections and selection of materials.
Microelectronic-interconnection design
Electro-Technology
Branch, G.L. (Autor:in) / Scapple, R.Y. (Autor:in)
Electro-Technology ; 69
1962
4 pages
Aufsatz (Zeitschrift)
Englisch
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