A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Microelectronic-interconnection design
Evaluation of materials and construction of microminiaturized component design; design parameters for ceramic wafers, microsoldered connections and selection of materials.
Microelectronic-interconnection design
Evaluation of materials and construction of microminiaturized component design; design parameters for ceramic wafers, microsoldered connections and selection of materials.
Microelectronic-interconnection design
Electro-Technology
Branch, G.L. (author) / Scapple, R.Y. (author)
Electro-Technology ; 69
1962
4 pages
Article (Journal)
English
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