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Bonding dissimilar ceramic components
BONDING DISSIMILAR CERAMIC COMPONENTS Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together. 16 12 18 20 Virgin substrate Far from bond Near bond Bond surface 26 Transition chemistry of a Bonded area 60 -carbon 60 50 - oxygen 040 --- silicon 30 - - -calcium 20 - - aluminum 10 - -- -boron 0 0 ------ lithium virgin far from nearbond bond bond surface Depth of Substrate 1
Bonding dissimilar ceramic components
BONDING DISSIMILAR CERAMIC COMPONENTS Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together. 16 12 18 20 Virgin substrate Far from bond Near bond Bond surface 26 Transition chemistry of a Bonded area 60 -carbon 60 50 - oxygen 040 --- silicon 30 - - -calcium 20 - - aluminum 10 - -- -boron 0 0 ------ lithium virgin far from nearbond bond bond surface Depth of Substrate 1
Bonding dissimilar ceramic components
CROOKS TAB HUNTER (Autor:in) / MUNECH MARYANN S (Autor:in)
16.05.2019
Patent
Elektronische Ressource
Englisch
IPC:
C09J
ADHESIVES
,
Klebstoffe
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C01D
Verbindungen der Alkalimetalle, d.h. des Lithiums, Natriums, Kaliums, Rubidiums, Cäsiums oder Franciums
,
COMPOUNDS OF ALKALI METALS, i.e. LITHIUM, SODIUM, POTASSIUM, RUBIDIUM, CAESIUM, OR FRANCIUM
/
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME