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Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate
The invention belongs to the field of composite material preparation, and relates to a preparation method for resin matrix composite materials, in particular to a preparation method for a microwave dielectric ceramic/resin bicontinuous composite material for a PCB substrate. The method aims at solving the technical problems that a ceramic/resin composite material obtained through an existing method has a low dielectric constant and large dielectric losses. The preparation method comprises the steps of 1, preparing a sizing agent; 2, preparing a porous ceramic green body with directional holes; 3, preparing a porous microwave dielectric ceramic preform body; 4, pouring resin at the temperature ranging from minus 20 DEG C to the normal temperature into a mold, conducting vacuumizing until the molten resin completely enters the porous microwave dielectric ceramic preform body, and conducting solidification to obtain the microwave dielectric ceramic/resin bicontinuous composite material. Due to the fact that the specific surface area of the porous microwave dielectric ceramic preform body is much smaller than the specific surface area of powder, interfacial polarization is lowered, and dielectric losses are lowered; in addition, the composite materials of different ceramic contents can be obtained according to the material requirement, and the dielectric constant is adjustable.
Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate
The invention belongs to the field of composite material preparation, and relates to a preparation method for resin matrix composite materials, in particular to a preparation method for a microwave dielectric ceramic/resin bicontinuous composite material for a PCB substrate. The method aims at solving the technical problems that a ceramic/resin composite material obtained through an existing method has a low dielectric constant and large dielectric losses. The preparation method comprises the steps of 1, preparing a sizing agent; 2, preparing a porous ceramic green body with directional holes; 3, preparing a porous microwave dielectric ceramic preform body; 4, pouring resin at the temperature ranging from minus 20 DEG C to the normal temperature into a mold, conducting vacuumizing until the molten resin completely enters the porous microwave dielectric ceramic preform body, and conducting solidification to obtain the microwave dielectric ceramic/resin bicontinuous composite material. Due to the fact that the specific surface area of the porous microwave dielectric ceramic preform body is much smaller than the specific surface area of powder, interfacial polarization is lowered, and dielectric losses are lowered; in addition, the composite materials of different ceramic contents can be obtained according to the material requirement, and the dielectric constant is adjustable.
Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate
YE FENG (Autor:in) / ZHANG BIAO (Autor:in) / GAO YE (Autor:in) / LIU QIANG (Autor:in) / LIU SHICHAO (Autor:in) / MA JIE (Autor:in) / DING JUNJIE (Autor:in)
10.06.2015
Patent
Elektronische Ressource
Englisch
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2022
| Europäisches Patentamt | 2022
| Europäisches Patentamt | 2020