Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention provides an attachment device for an architectural decoration panel with a heat dissipation function and an application method of the attachment device. The architectural decoration panel (7) is attached to a building body (9) through an attaching and bonding layer (8). The architectural decoration panel (7) comprises a back face plane facing the attaching and bonding layer (8), and a front face plane opposite to the back face plane. A bonding layer filling groove (72) which extends in the horizontal direction and is indented inwards from the back face plane is formed in the middle of the back face plane. One end, in the horizontal direction, of the bonding layer filling groove (72) is provided with an opening, and the other end of the bonding layer filling groove (72) is closed. Horizontal circular flanges (74) are arranged on the upper horizontal edge and the lower horizontal edge of the bonding layer filling groove (72) respectively. The cross sections of the tail ends of the horizontal circular flanges (74) are each in an outwards-protruding arc shape. Horizontal circular hidden grooves (73) are formed between the horizontal circular flanges (74) and the groove bottom of the bonding layer filling groove (72).
The invention provides an attachment device for an architectural decoration panel with a heat dissipation function and an application method of the attachment device. The architectural decoration panel (7) is attached to a building body (9) through an attaching and bonding layer (8). The architectural decoration panel (7) comprises a back face plane facing the attaching and bonding layer (8), and a front face plane opposite to the back face plane. A bonding layer filling groove (72) which extends in the horizontal direction and is indented inwards from the back face plane is formed in the middle of the back face plane. One end, in the horizontal direction, of the bonding layer filling groove (72) is provided with an opening, and the other end of the bonding layer filling groove (72) is closed. Horizontal circular flanges (74) are arranged on the upper horizontal edge and the lower horizontal edge of the bonding layer filling groove (72) respectively. The cross sections of the tail ends of the horizontal circular flanges (74) are each in an outwards-protruding arc shape. Horizontal circular hidden grooves (73) are formed between the horizontal circular flanges (74) and the groove bottom of the bonding layer filling groove (72).
Attachment device for architectural decoration panel with heat dissipation function and application method of attachment device
FAN AISU (Autor:in)
22.07.2015
Patent
Elektronische Ressource
Englisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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