Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Wallboard with good heat-resistant caking property and excellent mechanical property
The invention discloses a wallboard with good heat-resistant caking property and excellent mechanical property. The wallboard includes a base layer, a bonding layer, an insulating layer, a plaster mortar layer, a fireproof layer, a waterproof layer, a latex layer, a decorative coating and a wear-resistant layer from the inside to the outside. The bonding layer is an epoxy adhesive comprising, by weight, 20-30 parts of a group A and 1-3 parts of a group B; the group A comprises, by weight, 30-40 parts of 711 epoxy resin, 5-10 parts of glycidyl aldehyde epoxy resin, 20-30 parts of a hydroxyl terminated imide intermediate, 10-20 parts of liquid polysulfide rubber JLY-124, 5-10 parts of modified phenolic resin, 45-50 parts of a basalt powder, 1-5 parts of nano silica, 2-8 parts of nanometer titanium dioxide and 5-10 parts of toluene; and the group B includes, by weight, 10-15 parts of a curing agent T-31, 1-2 parts of a coupling agent KH-550, and 0.5-1 part of an accelerator DMP-30.
Wallboard with good heat-resistant caking property and excellent mechanical property
The invention discloses a wallboard with good heat-resistant caking property and excellent mechanical property. The wallboard includes a base layer, a bonding layer, an insulating layer, a plaster mortar layer, a fireproof layer, a waterproof layer, a latex layer, a decorative coating and a wear-resistant layer from the inside to the outside. The bonding layer is an epoxy adhesive comprising, by weight, 20-30 parts of a group A and 1-3 parts of a group B; the group A comprises, by weight, 30-40 parts of 711 epoxy resin, 5-10 parts of glycidyl aldehyde epoxy resin, 20-30 parts of a hydroxyl terminated imide intermediate, 10-20 parts of liquid polysulfide rubber JLY-124, 5-10 parts of modified phenolic resin, 45-50 parts of a basalt powder, 1-5 parts of nano silica, 2-8 parts of nanometer titanium dioxide and 5-10 parts of toluene; and the group B includes, by weight, 10-15 parts of a curing agent T-31, 1-2 parts of a coupling agent KH-550, and 0.5-1 part of an accelerator DMP-30.
Wallboard with good heat-resistant caking property and excellent mechanical property
ZHENG PENG (Autor:in)
23.12.2015
Patent
Elektronische Ressource
Englisch
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