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Wallboard with excellent mechanical property, good bonding effect and low peeling possibility
The invention discloses a wallboard with excellent mechanical property, good bonding effect and low peeling possibility. The wallboard comprises a base layer, a bonding layer, a heat preservation layer, a surface mortar layer, a fireproof layer, a waterproof layer, an emulsion layer, a decorative coating layer and a wearproof layer which are sequentially arranged from inside to outside, wherein the bonding layer is an epoxy bonding agent; the epoxy bonding agent comprises the following raw materials in parts by weight: 30-40 parts of a composition A and 0.5-2 parts of a composition B; the composition A comprises the following components in parts by weight: 20-30 parts of bisphenol A-type glycidyl ether epoxy resin, 15-20 parts of glycidaldehyde epoxy resin, 20-30 parts of modified phenolic resin, 2-10 parts of hydroxy-terminated liquid nitrile rubber, 5-15 parts of liquid polysulfide rubber JLY-124, 20-30 parts of quartz powder, 5-10 parts of nanometer silicon dioxide, 8-12 parts of nanometer titanium dioxide and 15-20 parts of para-xylene; the composition B comprises the following components in parts by weight: 20-30 parts of maleic anhydride, 1-1.8 parts of a coupling agent KH-550 and 2-3 parts of an accelerant DMP-30.
Wallboard with excellent mechanical property, good bonding effect and low peeling possibility
The invention discloses a wallboard with excellent mechanical property, good bonding effect and low peeling possibility. The wallboard comprises a base layer, a bonding layer, a heat preservation layer, a surface mortar layer, a fireproof layer, a waterproof layer, an emulsion layer, a decorative coating layer and a wearproof layer which are sequentially arranged from inside to outside, wherein the bonding layer is an epoxy bonding agent; the epoxy bonding agent comprises the following raw materials in parts by weight: 30-40 parts of a composition A and 0.5-2 parts of a composition B; the composition A comprises the following components in parts by weight: 20-30 parts of bisphenol A-type glycidyl ether epoxy resin, 15-20 parts of glycidaldehyde epoxy resin, 20-30 parts of modified phenolic resin, 2-10 parts of hydroxy-terminated liquid nitrile rubber, 5-15 parts of liquid polysulfide rubber JLY-124, 20-30 parts of quartz powder, 5-10 parts of nanometer silicon dioxide, 8-12 parts of nanometer titanium dioxide and 15-20 parts of para-xylene; the composition B comprises the following components in parts by weight: 20-30 parts of maleic anhydride, 1-1.8 parts of a coupling agent KH-550 and 2-3 parts of an accelerant DMP-30.
Wallboard with excellent mechanical property, good bonding effect and low peeling possibility
ZHENG PENG (Autor:in)
30.12.2015
Patent
Elektronische Ressource
Englisch
IPC:
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C09J
ADHESIVES
,
Klebstoffe
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