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Hollow door
The invention discloses a hollow door. By the adoption of the hollow door, heat loss is reduced, environment temperature can be well maintained, and the certain requirements for heat insulation in the semiconductor wafer technology can be met. According to the technical scheme, a hollow layer used for heat insulation is designed between two panels to enable the interior of a certain space to be isolated from the outside. Compared with the prior art, the hollow door has the advantage that equipment, including a XeF2 etching system and a gumming machine, required to be at certain environment temperature in the semiconductor wafer technology can well meet the temperature requirement.
Hollow door
The invention discloses a hollow door. By the adoption of the hollow door, heat loss is reduced, environment temperature can be well maintained, and the certain requirements for heat insulation in the semiconductor wafer technology can be met. According to the technical scheme, a hollow layer used for heat insulation is designed between two panels to enable the interior of a certain space to be isolated from the outside. Compared with the prior art, the hollow door has the advantage that equipment, including a XeF2 etching system and a gumming machine, required to be at certain environment temperature in the semiconductor wafer technology can well meet the temperature requirement.
Hollow door
FANG ZHIYOU (Autor:in) / JIN YINUO (Autor:in) / ZHANG HUAIDONG (Autor:in) / WANG JIAN (Autor:in) / WANG HUI (Autor:in)
10.02.2016
Patent
Elektronische Ressource
Englisch
IPC:
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
Hollow Door Assembling Method And Hollow Door Assembled Thereby
Europäisches Patentamt | 2016
|