Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of mullite-corundum composite ceramic substrate for electronic packaging
The invention provides a preparation method of a mullite-corundum composite ceramic substrate for electronic packaging, which comprises the following steps: (1) preparing a base material which comprises, by mass, 5%-15% of kaolin and 85%-95% of aluminum oxide, and preparing an auxiliary material composed of magnesium oxide and molybdenum oxide, wherein the use amount of the magnesium oxide accounts for 0.5%-1.5% of the mass of the base material, and the use amount of the molybdenum oxide accounts for 5%-10% of the mass of the base material; (2) ball-milling and mixing the base material and theauxiliary material prepared in the step (1) to obtain a mixture; (3) granulating the mixture by adopting a spraying method, and then ageing to obtain a preform body; (4) pressing the preform body into a ceramic substrate blank; and (5) drying, sintering and cooling the ceramic substrate blank to obtain the mullite-corundum composite ceramic substrate. The mechanical property and the dielectric property of the mullite-corundum composite ceramic substrate prepared through the method are remarkably improved.
本发明提供一种电子封装用莫来石‑刚玉复合陶瓷基片的制备方法，包括如下步骤：步骤1)：准备基料，所述基料按质量百分比含5％～15％的高岭土和85％～95％的氧化铝；准备辅料，所述辅料由氧化镁和氧化钼组成，其中氧化镁用量为所述基料质量的0.5％～1.5％，氧化钼用量为所述基料质量的5％～10％；步骤2)：将步骤1)准备的基料和辅料球磨混合，得到混合料；步骤3)：将所述混合料采用喷雾法造粒，然后陈腐，得到坯料；步骤4)：将所述坯料压制成陶瓷基片坯体；步骤5)：将所述陶瓷基片坯体干燥后，烧成，冷却后得到莫来石‑刚玉复合陶瓷基片。本发明方法制备得到的莫来石‑刚玉复合陶瓷基片力学性能和介电性能显著提高。
Preparation method of mullite-corundum composite ceramic substrate for electronic packaging
The invention provides a preparation method of a mullite-corundum composite ceramic substrate for electronic packaging, which comprises the following steps: (1) preparing a base material which comprises, by mass, 5%-15% of kaolin and 85%-95% of aluminum oxide, and preparing an auxiliary material composed of magnesium oxide and molybdenum oxide, wherein the use amount of the magnesium oxide accounts for 0.5%-1.5% of the mass of the base material, and the use amount of the molybdenum oxide accounts for 5%-10% of the mass of the base material; (2) ball-milling and mixing the base material and theauxiliary material prepared in the step (1) to obtain a mixture; (3) granulating the mixture by adopting a spraying method, and then ageing to obtain a preform body; (4) pressing the preform body into a ceramic substrate blank; and (5) drying, sintering and cooling the ceramic substrate blank to obtain the mullite-corundum composite ceramic substrate. The mechanical property and the dielectric property of the mullite-corundum composite ceramic substrate prepared through the method are remarkably improved.
本发明提供一种电子封装用莫来石‑刚玉复合陶瓷基片的制备方法，包括如下步骤：步骤1)：准备基料，所述基料按质量百分比含5％～15％的高岭土和85％～95％的氧化铝；准备辅料，所述辅料由氧化镁和氧化钼组成，其中氧化镁用量为所述基料质量的0.5％～1.5％，氧化钼用量为所述基料质量的5％～10％；步骤2)：将步骤1)准备的基料和辅料球磨混合，得到混合料；步骤3)：将所述混合料采用喷雾法造粒，然后陈腐，得到坯料；步骤4)：将所述坯料压制成陶瓷基片坯体；步骤5)：将所述陶瓷基片坯体干燥后，烧成，冷却后得到莫来石‑刚玉复合陶瓷基片。本发明方法制备得到的莫来石‑刚玉复合陶瓷基片力学性能和介电性能显著提高。
Preparation method of mullite-corundum composite ceramic substrate for electronic packaging
一种电子封装用莫来石-刚玉复合陶瓷基片的制备方法
XU XIAOHONG (Autor:in) / CHU SHIJUN (Autor:in) / WU JIANFENG (Autor:in)
09.06.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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