Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Metallization method of ceramic substrate
The invention relates to a metallization method for a ceramic substrate, and the method comprises the following steps of firstly, carrying out the patterning processing on the surface of the ceramic substrate according to a preset conductive circuit parameter so as to form a circuit pattern with the preset depth and width on the surface of the ceramic substrate; secondly, preparing a transition metal layer and a thickened metal layer on the surface of the patterned ceramic substrate; and then, removing the metal layer of the non-circuit pattern part on the surface of the ceramic substrate to obtain a conductive metal circuit filled in the ceramic substrate, and carrying out surface treatment to finally obtain a flat and smooth high-precision ceramic circuit board. According to the invention, the circuit pattern with the preset depth and width is prepared on the ceramic substrate in advance, the circuit pattern is inserted into the ceramic substrate, and the width and the thickness of the conductive metal circuit in the metallization process can be controlled with high precision, so that the high-precision conductive metal circuit is obtained; and meanwhile, the conductive metal circuit is filled in the circuit pattern of the ceramic substrate, so that the heat dissipation efficiency is also improved.
本发明涉及一种陶瓷基板的金属化方法，包括如下步骤：首先，根据预设的导电线路参数在陶瓷基板表面进行图案化处理以在陶瓷基板表面形成有预设深度与宽度的线路图案；然后，在经过图案化处理的陶瓷基板表面制备过渡金属层和加厚金属层；之后，将陶瓷基板表面的非线路图案部分的金属层除去，以得到填充于陶瓷基板内的导电金属线路，进行表面处理后，最终得到平整光滑的高精度陶瓷线路板；本发明通过预先在陶瓷基板上制备预设深度和宽度的线路图案，将线路图案深入到陶瓷基板内部，可高精度控制金属化过程中的导电金属线路的宽度与厚度，从而得到高精细化导电金属线路，同时，本发明的导电金属线路填充于陶瓷基板的线路图案内也提高了散热效率。
Metallization method of ceramic substrate
The invention relates to a metallization method for a ceramic substrate, and the method comprises the following steps of firstly, carrying out the patterning processing on the surface of the ceramic substrate according to a preset conductive circuit parameter so as to form a circuit pattern with the preset depth and width on the surface of the ceramic substrate; secondly, preparing a transition metal layer and a thickened metal layer on the surface of the patterned ceramic substrate; and then, removing the metal layer of the non-circuit pattern part on the surface of the ceramic substrate to obtain a conductive metal circuit filled in the ceramic substrate, and carrying out surface treatment to finally obtain a flat and smooth high-precision ceramic circuit board. According to the invention, the circuit pattern with the preset depth and width is prepared on the ceramic substrate in advance, the circuit pattern is inserted into the ceramic substrate, and the width and the thickness of the conductive metal circuit in the metallization process can be controlled with high precision, so that the high-precision conductive metal circuit is obtained; and meanwhile, the conductive metal circuit is filled in the circuit pattern of the ceramic substrate, so that the heat dissipation efficiency is also improved.
本发明涉及一种陶瓷基板的金属化方法，包括如下步骤：首先，根据预设的导电线路参数在陶瓷基板表面进行图案化处理以在陶瓷基板表面形成有预设深度与宽度的线路图案；然后，在经过图案化处理的陶瓷基板表面制备过渡金属层和加厚金属层；之后，将陶瓷基板表面的非线路图案部分的金属层除去，以得到填充于陶瓷基板内的导电金属线路，进行表面处理后，最终得到平整光滑的高精度陶瓷线路板；本发明通过预先在陶瓷基板上制备预设深度和宽度的线路图案，将线路图案深入到陶瓷基板内部，可高精度控制金属化过程中的导电金属线路的宽度与厚度，从而得到高精细化导电金属线路，同时，本发明的导电金属线路填充于陶瓷基板的线路图案内也提高了散热效率。
Metallization method of ceramic substrate
一种陶瓷基板的金属化方法
JIANG YONGJING (Autor:in) / LIU NANLIU (Autor:in) / WANG QI (Autor:in) / ZHANG GUOYI (Autor:in) / XU CHENWEN (Autor:in)
17.07.2020
Patent
Elektronische Ressource
Chinesisch
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