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Assembled wall top packaging structure and installation method thereof
The invention discloses an assembled wall top packaging structure and an installation method thereof, and relates to the technical field of buildings. The assembled wall top packaging structure can fill a gap between wall modules and a building top plate and improve the stability and safety of the assembled wall. The assembled wall top packaging structure comprises the wall modules, fixing pieces,panel strips and sound insulation and heat insulation materials; the wall modules comprises profile frames, each profile frame comprises two overlapping profiles oppositely arranged, and each overlapping profile comprise a bottom plate, and a first wing plate and a second wing plate positioned on two sides of the bottom plate; each fixing piece comprises an insertion section and a fixing plate, and the fixing plate is perpendicular to the insertion section and fixedly connected with one end of the insertion section; the insertion section is inserted into the overlapping profiles, and the fixing plates are fixedly attached to the building top plate; the width of each panel strip is equal to the interval between the top of each wall module and the building top plate, and the panel strips are fixedly attached to the outer walls of side plates of the fixing pieces; and the sound insulation and heat insulation materials fill between any two opposite panel strips. The assembled wall top packaging structure and the installation method thereof are used for constructing a wall.
本发明公开了一种装配式墙体顶部封装结构及其安装方法,涉及建筑技术领域,能够填充墙体模块与建筑顶板之间的间隙,提升装配式墙体的稳定性和安全性。装配式墙体顶部封装结构包括墙体模块、固定件、面板条和隔音保温材料;墙体模块包括型材框架,型材框架包括两个相对设置的搭接型材,搭接型材包括底板和位于底板两侧的第一翼板和第二翼板;固定件包括插接段和固定板,固定板与插接段垂直,且与插接段的一端固定连接;插接段与搭接型材插接,固定板与建筑顶板贴合固定;面板条的宽度等于墙体模块顶部与建筑顶板之间的间隔,面板条与固定件的侧板的外壁贴合固定;隔音保温材料填充于任意两个相对的面板条之间。本发明用于构建墙体。
Assembled wall top packaging structure and installation method thereof
The invention discloses an assembled wall top packaging structure and an installation method thereof, and relates to the technical field of buildings. The assembled wall top packaging structure can fill a gap between wall modules and a building top plate and improve the stability and safety of the assembled wall. The assembled wall top packaging structure comprises the wall modules, fixing pieces,panel strips and sound insulation and heat insulation materials; the wall modules comprises profile frames, each profile frame comprises two overlapping profiles oppositely arranged, and each overlapping profile comprise a bottom plate, and a first wing plate and a second wing plate positioned on two sides of the bottom plate; each fixing piece comprises an insertion section and a fixing plate, and the fixing plate is perpendicular to the insertion section and fixedly connected with one end of the insertion section; the insertion section is inserted into the overlapping profiles, and the fixing plates are fixedly attached to the building top plate; the width of each panel strip is equal to the interval between the top of each wall module and the building top plate, and the panel strips are fixedly attached to the outer walls of side plates of the fixing pieces; and the sound insulation and heat insulation materials fill between any two opposite panel strips. The assembled wall top packaging structure and the installation method thereof are used for constructing a wall.
本发明公开了一种装配式墙体顶部封装结构及其安装方法,涉及建筑技术领域,能够填充墙体模块与建筑顶板之间的间隙,提升装配式墙体的稳定性和安全性。装配式墙体顶部封装结构包括墙体模块、固定件、面板条和隔音保温材料;墙体模块包括型材框架,型材框架包括两个相对设置的搭接型材,搭接型材包括底板和位于底板两侧的第一翼板和第二翼板;固定件包括插接段和固定板,固定板与插接段垂直,且与插接段的一端固定连接;插接段与搭接型材插接,固定板与建筑顶板贴合固定;面板条的宽度等于墙体模块顶部与建筑顶板之间的间隔,面板条与固定件的侧板的外壁贴合固定;隔音保温材料填充于任意两个相对的面板条之间。本发明用于构建墙体。
Assembled wall top packaging structure and installation method thereof
一种装配式墙体顶部封装结构及其安装方法
ZHAO YONGSHENG (Autor:in)
08.09.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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