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Low-temperature ceramization layer slurry and low-temperature ceramization organic plate compounded with same
The invention belongs to the technical field of building decoration, and particularly relates to low-temperature ceramization layer slurry and a low-temperature ceramization organic plate compounded with the same. The invention aims at the problems of low-temperature ceramization layer slurry and a low-temperature ceramization organic plate compounded with the slurry in the prior art, and providesthe low-temperature ceramization layer slurry and the low-temperature ceramization organic plate compounded with the same, which comprise a skeleton layer 1 consisting of organic plates, and a low-temperature ceramization layer 2 is directly covered on the surface of the skeleton layer 1. The low-temperature ceramization layer 2 is prepared from low-temperature ceramization layer slurry. According to the low-temperature porcelainized organic board compounded with the low-temperature porcelainized layer slurry, a structural bottom board, a gypsum board and a putty layer are directly combined into a whole, wherein the surface of the porcelainized layer is smooth and does not need to be polished, only slight treatment needs to be conducted at the abutted seam, and then latex paint is sprayed. Compared with a traditional mode, time and labor are saved, construction pollution is reduced, attractiveness and delicacy are achieved, and roof and wall surface seamless quick mounting is achieved.
本发明属于建筑装饰技术领域,尤其涉及一种低温瓷化层浆料和复合有该浆料的低温瓷化有机板。本发明针对现有技术中一种低温瓷化层浆料和复合有该浆料的低温瓷化有机板的问题,提供低温瓷化层浆料和复合有该浆料的低温瓷化有机板,包括包括由有机板组成的骨架层1,所述的骨架层1表面直接覆盖低温瓷化层2,所述低温瓷化层2由、低温瓷化层浆料制得。本发明提供的复合有低温瓷化层浆料的低温瓷化有机板,直接将结构底板/石膏板/腻子灰层三者合一,瓷化层表面光滑无需打磨,只需要在拼缝处稍加处理,再喷乳胶漆便可完成。比传统的方式省时省力减少施工污染,又更加美观精致,顶墙面无缝快装。
Low-temperature ceramization layer slurry and low-temperature ceramization organic plate compounded with same
The invention belongs to the technical field of building decoration, and particularly relates to low-temperature ceramization layer slurry and a low-temperature ceramization organic plate compounded with the same. The invention aims at the problems of low-temperature ceramization layer slurry and a low-temperature ceramization organic plate compounded with the slurry in the prior art, and providesthe low-temperature ceramization layer slurry and the low-temperature ceramization organic plate compounded with the same, which comprise a skeleton layer 1 consisting of organic plates, and a low-temperature ceramization layer 2 is directly covered on the surface of the skeleton layer 1. The low-temperature ceramization layer 2 is prepared from low-temperature ceramization layer slurry. According to the low-temperature porcelainized organic board compounded with the low-temperature porcelainized layer slurry, a structural bottom board, a gypsum board and a putty layer are directly combined into a whole, wherein the surface of the porcelainized layer is smooth and does not need to be polished, only slight treatment needs to be conducted at the abutted seam, and then latex paint is sprayed. Compared with a traditional mode, time and labor are saved, construction pollution is reduced, attractiveness and delicacy are achieved, and roof and wall surface seamless quick mounting is achieved.
本发明属于建筑装饰技术领域,尤其涉及一种低温瓷化层浆料和复合有该浆料的低温瓷化有机板。本发明针对现有技术中一种低温瓷化层浆料和复合有该浆料的低温瓷化有机板的问题,提供低温瓷化层浆料和复合有该浆料的低温瓷化有机板,包括包括由有机板组成的骨架层1,所述的骨架层1表面直接覆盖低温瓷化层2,所述低温瓷化层2由、低温瓷化层浆料制得。本发明提供的复合有低温瓷化层浆料的低温瓷化有机板,直接将结构底板/石膏板/腻子灰层三者合一,瓷化层表面光滑无需打磨,只需要在拼缝处稍加处理,再喷乳胶漆便可完成。比传统的方式省时省力减少施工污染,又更加美观精致,顶墙面无缝快装。
Low-temperature ceramization layer slurry and low-temperature ceramization organic plate compounded with same
低温瓷化层浆料和复合有该浆料的低温瓷化有机板
HE XIANBING (Autor:in)
03.11.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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