Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of copper paste printed circuit board
The invention discloses a preparation method of a copper paste printed circuit board. The method comprises the following steps: printing copper paste on a substrate, drying to remove volatile substances, and sintering in a non-oxidizing atmosphere according to a designed circuit pattern to obtain the copper paste printed circuit board, wherein the copper paste comprises mixed two-component copperpowder, the diameter of the two-component copper powder is 1-50 microns, the diameter ratio of the two-component copper powder is (1.5-2.5):1, and the mixing ratio is 1:(0.4-1.5) in parts by weight. According to the preparation method disclosed by the invention, the copper paste prepared from high-density powder is obtained by limiting the proportion of double-component copper powder in the copperpaste, and the sintering atmosphere proportion is limited, so that copper powder particles are moderate in contact area and good in dispersity, the problems of price limitation and environmental protection of an original process are solved, and a copper layer is high in density and good in conductivity; and a gas-shielded sintering process is adopted, so that the application of antioxidant compounds can be avoided, the pollution of redundant raw materials is avoided, and the antioxidant effect is improved.
本发明公开一种铜浆印制电路板的制备方法，将铜浆印刷于基板上，干燥去除挥发性物质后，根据设计的电路图案使用非氧化性气氛烧结，得到所述铜浆印制电路板；所述铜浆包括混合的双组份铜粉，双组份铜粉的直径为1～50μm，双组份铜粉的直径比为1.5～2.5:1，混合比例按照重量份为1:0.4～1.5。本发明的制备方法通过限制了铜浆中双组份铜粉的比例结合得到高密度粉体制得的铜浆，限制了烧结的气氛比例，使得铜粉颗粒接触面积适中，分散度好，改进了原有工艺的价格限制和环保问题，铜层密度高，电导率好；同时采用气体保护烧结工艺，可以免除对抗氧化化合物的应用，避免多余原料污染，同时增加了抗氧化效果。
Preparation method of copper paste printed circuit board
The invention discloses a preparation method of a copper paste printed circuit board. The method comprises the following steps: printing copper paste on a substrate, drying to remove volatile substances, and sintering in a non-oxidizing atmosphere according to a designed circuit pattern to obtain the copper paste printed circuit board, wherein the copper paste comprises mixed two-component copperpowder, the diameter of the two-component copper powder is 1-50 microns, the diameter ratio of the two-component copper powder is (1.5-2.5):1, and the mixing ratio is 1:(0.4-1.5) in parts by weight. According to the preparation method disclosed by the invention, the copper paste prepared from high-density powder is obtained by limiting the proportion of double-component copper powder in the copperpaste, and the sintering atmosphere proportion is limited, so that copper powder particles are moderate in contact area and good in dispersity, the problems of price limitation and environmental protection of an original process are solved, and a copper layer is high in density and good in conductivity; and a gas-shielded sintering process is adopted, so that the application of antioxidant compounds can be avoided, the pollution of redundant raw materials is avoided, and the antioxidant effect is improved.
本发明公开一种铜浆印制电路板的制备方法，将铜浆印刷于基板上，干燥去除挥发性物质后，根据设计的电路图案使用非氧化性气氛烧结，得到所述铜浆印制电路板；所述铜浆包括混合的双组份铜粉，双组份铜粉的直径为1～50μm，双组份铜粉的直径比为1.5～2.5:1，混合比例按照重量份为1:0.4～1.5。本发明的制备方法通过限制了铜浆中双组份铜粉的比例结合得到高密度粉体制得的铜浆，限制了烧结的气氛比例，使得铜粉颗粒接触面积适中，分散度好，改进了原有工艺的价格限制和环保问题，铜层密度高，电导率好；同时采用气体保护烧结工艺，可以免除对抗氧化化合物的应用，避免多余原料污染，同时增加了抗氧化效果。
Preparation method of copper paste printed circuit board
一种铜浆印制电路板的制备方法
ZHAO JINGWEI (Autor:in) / NIE FENG (Autor:in)
11.12.2020
Patent
Elektronische Ressource
Chinesisch
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