Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of printed circuit board
The invention discloses a preparation method of a printed circuit board. The method comprises the following steps that: copper paste is printed on a substrate to form a pattern, and the copper paste is dried, so that a printed circuit board with a copper powder pattern can be obtained; under the protection of a non-oxidizing atmosphere, the printed circuit board with the copper powder pattern is heated through high-frequency electromagnetic induction; and the copper powder melts and adheres to each other to form a copper layer with an integrated pattern. According to the preparation method, ahigh-frequency electromagnetic oscillation mode is adopted, so that the copper powder is melted in a short time to form the complete circuit copper layer, meanwhile, a ceramic substrate serving as a base material is hardly subjected to thermal shock, so that fragmentation risks can be avoided; sintering time is short, energy is accurately input, and therefore, the requirement for a protective atmosphere can be lowered; and the formed metal copper layer has the advantages of good definition, low oxidation degree and good conductivity.
本发明公开了一种印制电路板的制备方法，包括如下步骤：将铜浆通过印刷在基板上形成图案后干燥，得到有铜粉图案的印制电路板；在非氧化性气氛保护下，将有铜粉图案的印制电路板通过高频电磁感应加热，铜粉熔化互相粘连形成一体化图案的铜层，本发明的制备方法通过高频电磁震荡的方式，使得铜粉在短时间内融化，形成完整的线路铜层，同时作为基材的陶瓷基板几乎不受到热冲击而产生碎裂风险，烧结时间短，能量投放准确，可以降低保护气氛要求，所形成的金属铜层具有清晰度优良、氧化程度低、电导率好的特点。
Preparation method of printed circuit board
The invention discloses a preparation method of a printed circuit board. The method comprises the following steps that: copper paste is printed on a substrate to form a pattern, and the copper paste is dried, so that a printed circuit board with a copper powder pattern can be obtained; under the protection of a non-oxidizing atmosphere, the printed circuit board with the copper powder pattern is heated through high-frequency electromagnetic induction; and the copper powder melts and adheres to each other to form a copper layer with an integrated pattern. According to the preparation method, ahigh-frequency electromagnetic oscillation mode is adopted, so that the copper powder is melted in a short time to form the complete circuit copper layer, meanwhile, a ceramic substrate serving as a base material is hardly subjected to thermal shock, so that fragmentation risks can be avoided; sintering time is short, energy is accurately input, and therefore, the requirement for a protective atmosphere can be lowered; and the formed metal copper layer has the advantages of good definition, low oxidation degree and good conductivity.
本发明公开了一种印制电路板的制备方法，包括如下步骤：将铜浆通过印刷在基板上形成图案后干燥，得到有铜粉图案的印制电路板；在非氧化性气氛保护下，将有铜粉图案的印制电路板通过高频电磁感应加热，铜粉熔化互相粘连形成一体化图案的铜层，本发明的制备方法通过高频电磁震荡的方式，使得铜粉在短时间内融化，形成完整的线路铜层，同时作为基材的陶瓷基板几乎不受到热冲击而产生碎裂风险，烧结时间短，能量投放准确，可以降低保护气氛要求，所形成的金属铜层具有清晰度优良、氧化程度低、电导率好的特点。
Preparation method of printed circuit board
一种印制电路板的制备方法
ZHAO JINGWEI (Autor:in) / NIE FENG (Autor:in) / LIU PEIPEI (Autor:in)
18.08.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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