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High-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conducting silica gel and preparation method thereof
The invention relates to high-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conducting silica gel and a preparation method thereof, and belongs to the technical field of electronic heat conduction, and the heat-conducting silica gel comprises the following components in parts by weight: 80-120 parts of dimethyl silicone oil, 650-1000 parts of heat-conducting filler, 300-500 parts of graphene oxide modified polyethylene glycol and 2-3.5 parts of silane coupling agent. The preparation method comprises the following steps: uniformly mixing the dimethyl silicone oil, the heat-conducting filler, the graphene oxide modified polyethylene glycol and the silane coupling agent, conducting heating to 130-140 DEG C, and conducting kneading for 40-50 minutes to obtain the heat-conducting silica gel. The heat-conducting silica gel prepared by the invention has the effects of high heat conductivity, low thermal resistance and high heat dissipation.
本发明涉及一种高导热低热阻高散热导热硅凝胶及其制备方法，属于电子导热技术领域，按重量份计，导热硅凝胶包含以下组分：二甲基硅油80‑120份、导热填料650‑1000份、氧化石墨烯改性聚乙二醇300‑500份、硅烷偶联剂2‑3.5份。制备方法包括：将二甲基硅油、导热填料、氧化石墨烯改性聚乙二醇、硅烷偶联剂混合均匀，并加热至130‑140℃后捏合40‑50min，得导热硅凝胶。本发明制备的导热硅凝胶具有高导热低热阻高散热的效果。
High-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conducting silica gel and preparation method thereof
The invention relates to high-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conducting silica gel and a preparation method thereof, and belongs to the technical field of electronic heat conduction, and the heat-conducting silica gel comprises the following components in parts by weight: 80-120 parts of dimethyl silicone oil, 650-1000 parts of heat-conducting filler, 300-500 parts of graphene oxide modified polyethylene glycol and 2-3.5 parts of silane coupling agent. The preparation method comprises the following steps: uniformly mixing the dimethyl silicone oil, the heat-conducting filler, the graphene oxide modified polyethylene glycol and the silane coupling agent, conducting heating to 130-140 DEG C, and conducting kneading for 40-50 minutes to obtain the heat-conducting silica gel. The heat-conducting silica gel prepared by the invention has the effects of high heat conductivity, low thermal resistance and high heat dissipation.
本发明涉及一种高导热低热阻高散热导热硅凝胶及其制备方法，属于电子导热技术领域，按重量份计，导热硅凝胶包含以下组分：二甲基硅油80‑120份、导热填料650‑1000份、氧化石墨烯改性聚乙二醇300‑500份、硅烷偶联剂2‑3.5份。制备方法包括：将二甲基硅油、导热填料、氧化石墨烯改性聚乙二醇、硅烷偶联剂混合均匀，并加热至130‑140℃后捏合40‑50min，得导热硅凝胶。本发明制备的导热硅凝胶具有高导热低热阻高散热的效果。
High-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conducting silica gel and preparation method thereof
一种高导热低热阻高散热导热硅凝胶及其制备方法
ZHANG WEILIN (Autor:in) / ZUO BINWEN (Autor:in) / HE FENGLAN (Autor:in)
11.12.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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