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High-thermal-conductivity silica gel and preparation method thereof
The invention relates to the technical field of heat conduction materials, in particular to high-heat-conduction silica gel and a preparation method thereof.The heat conduction performance and the mechanical strength of the high-heat-conduction silica gel are remarkably improved by introducing heat conduction filler prepared from graphene and boron nitride and optimizing the silicon source ratio of the high-heat-conduction silica gel. The stirring equipment is optimally arranged in the preparation process of the high-thermal-conductivity silica gel, the viscosity can be reduced by heating the interior of a mixture through a heating and uniform stirring structure, the attached mixture can be scraped and stirred in the silo, a plurality of stirring positions are expanded or retracted, different positions are stirred, the mixing uniformity is enhanced, and the high-thermal-conductivity silica gel is prepared. By means of the structure, all the components are easier to disperse, uniform distribution of heat can be guaranteed, mixing uniformity is enhanced, the position of the discharging port can be adjusted to make contact with the inner wall of a mold used for loading a gel mixture through the discharging structure, the mixture flows into the mold through the inner wall of the mold, bubbles generated when the mixture enters the mold are reduced, and the product quality is improved. The preparation efficiency of the silica gel is improved.
本发明涉及导热材料技术领域,具体涉及一种高导热硅凝胶及其制备方法,高导热硅凝胶通过引入石墨烯和氮化硼制得的导热填料及优化了的硅源配比,显著提高了其导热性能和机械强度。本发明在高导热硅凝胶的制备过程中优化设置了搅制设备,通过加热匀搅结构能在混合物内部加热以降低粘度,且在仓筒内部可将附着的混合物刮下搅动,并使多个搅拌处进行展开或缩回,对不同的位置搅动,增强混合均匀性,将使得各组分更易于分散,且能确保热量均匀分布,增强混合均匀性,并且通过出料结构可将出料口的位置调节接触在用于装载凝胶混合物的模具内壁,使混合物通过模具内壁以流入模具中,减少混合物进入模具时气泡的产生,提高硅凝胶的制备效率。
High-thermal-conductivity silica gel and preparation method thereof
The invention relates to the technical field of heat conduction materials, in particular to high-heat-conduction silica gel and a preparation method thereof.The heat conduction performance and the mechanical strength of the high-heat-conduction silica gel are remarkably improved by introducing heat conduction filler prepared from graphene and boron nitride and optimizing the silicon source ratio of the high-heat-conduction silica gel. The stirring equipment is optimally arranged in the preparation process of the high-thermal-conductivity silica gel, the viscosity can be reduced by heating the interior of a mixture through a heating and uniform stirring structure, the attached mixture can be scraped and stirred in the silo, a plurality of stirring positions are expanded or retracted, different positions are stirred, the mixing uniformity is enhanced, and the high-thermal-conductivity silica gel is prepared. By means of the structure, all the components are easier to disperse, uniform distribution of heat can be guaranteed, mixing uniformity is enhanced, the position of the discharging port can be adjusted to make contact with the inner wall of a mold used for loading a gel mixture through the discharging structure, the mixture flows into the mold through the inner wall of the mold, bubbles generated when the mixture enters the mold are reduced, and the product quality is improved. The preparation efficiency of the silica gel is improved.
本发明涉及导热材料技术领域,具体涉及一种高导热硅凝胶及其制备方法,高导热硅凝胶通过引入石墨烯和氮化硼制得的导热填料及优化了的硅源配比,显著提高了其导热性能和机械强度。本发明在高导热硅凝胶的制备过程中优化设置了搅制设备,通过加热匀搅结构能在混合物内部加热以降低粘度,且在仓筒内部可将附着的混合物刮下搅动,并使多个搅拌处进行展开或缩回,对不同的位置搅动,增强混合均匀性,将使得各组分更易于分散,且能确保热量均匀分布,增强混合均匀性,并且通过出料结构可将出料口的位置调节接触在用于装载凝胶混合物的模具内壁,使混合物通过模具内壁以流入模具中,减少混合物进入模具时气泡的产生,提高硅凝胶的制备效率。
High-thermal-conductivity silica gel and preparation method thereof
一种高导热硅凝胶及其制备方法
LIU WEIPING (Autor:in) / TAN CHENGYE (Autor:in) / ZHANG CAIGEN (Autor:in) / CHEN JINDUI (Autor:in)
13.12.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
B01F
MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
,
Mischen, z.B. Lösen, Emulgieren, Dispergieren
/
B01D
SEPARATION
,
Trennen
/
B01J
Chemische oder physikalische Verfahren, z.B. Katalyse oder Kolloidchemie
,
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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