Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for coating copper or copper alloy on surface of aluminum nitride ceramic
The invention discloses a method for coating copper or copper alloy on the surface of aluminum nitride ceramic, which comprises the following steps of selecting metal copper or copper alloy powder, and spraying the metal copper or copper alloy powder on the surface of an aluminum nitride ceramic substrate covered with a mask plate with a specific pattern in a molten state through an atmospheric plasma spraying technology, and adjusting a plurality of process parameters and a plasma torch structure to prepare the aluminum nitride ceramic copper-coated substrate with high interface bonding strength between the copper or copper alloy and the aluminum nitride ceramic and high conductivity. According to the method, the metal copper or copper alloy powder is directly sprayed on the high-thermal-conductivity aluminum nitride ceramic substrate to obtain the copper ceramic substrate, or the copper or copper alloy powder is sprayed on the high-thermal-conductivity aluminum nitride ceramic substrate covered with the mask of the circuit pattern to obtain the copper-coated circuit ceramic substrate with different patterns and high line width precision; the method is a novel copper-coated or copper alloy aluminum nitride ceramic substrate and a preparation method thereof, and the method is simple, can realize rapid and large-area preparation, reduces the cost, and has a wide application prospect.
本申请公开了一种在氮化铝陶瓷表面敷铜或敷铜合金的方法，选用金属铜或铜合金粉体，通过大气等离子喷涂技术将金属铜或铜合金粉体在熔融状态下喷涂在覆盖有特定图案掩模版的氮化铝陶瓷基板表面，调整诸多工艺参数和等离子体喷枪结构制备出铜或铜合金与氮化铝陶瓷界面结合强度高、电导率高的氮化铝陶瓷敷铜基板。本申请直接将金属铜或铜合金粉末喷涂在高导热氮化铝陶瓷基板上得到铜陶瓷基板或者将铜或铜合金粉末喷涂在覆盖有电路图案的掩膜的高导热氮化铝陶瓷基板上，得到不同图案且线宽精度高的敷铜电路陶瓷基板，是一种新的敷铜或铜合金氮化铝陶瓷基板及制备方法，该方法简单，可以实现快速、大面积制备，降低成本，具有广阔的应用前景。
Method for coating copper or copper alloy on surface of aluminum nitride ceramic
The invention discloses a method for coating copper or copper alloy on the surface of aluminum nitride ceramic, which comprises the following steps of selecting metal copper or copper alloy powder, and spraying the metal copper or copper alloy powder on the surface of an aluminum nitride ceramic substrate covered with a mask plate with a specific pattern in a molten state through an atmospheric plasma spraying technology, and adjusting a plurality of process parameters and a plasma torch structure to prepare the aluminum nitride ceramic copper-coated substrate with high interface bonding strength between the copper or copper alloy and the aluminum nitride ceramic and high conductivity. According to the method, the metal copper or copper alloy powder is directly sprayed on the high-thermal-conductivity aluminum nitride ceramic substrate to obtain the copper ceramic substrate, or the copper or copper alloy powder is sprayed on the high-thermal-conductivity aluminum nitride ceramic substrate covered with the mask of the circuit pattern to obtain the copper-coated circuit ceramic substrate with different patterns and high line width precision; the method is a novel copper-coated or copper alloy aluminum nitride ceramic substrate and a preparation method thereof, and the method is simple, can realize rapid and large-area preparation, reduces the cost, and has a wide application prospect.
本申请公开了一种在氮化铝陶瓷表面敷铜或敷铜合金的方法，选用金属铜或铜合金粉体，通过大气等离子喷涂技术将金属铜或铜合金粉体在熔融状态下喷涂在覆盖有特定图案掩模版的氮化铝陶瓷基板表面，调整诸多工艺参数和等离子体喷枪结构制备出铜或铜合金与氮化铝陶瓷界面结合强度高、电导率高的氮化铝陶瓷敷铜基板。本申请直接将金属铜或铜合金粉末喷涂在高导热氮化铝陶瓷基板上得到铜陶瓷基板或者将铜或铜合金粉末喷涂在覆盖有电路图案的掩膜的高导热氮化铝陶瓷基板上，得到不同图案且线宽精度高的敷铜电路陶瓷基板，是一种新的敷铜或铜合金氮化铝陶瓷基板及制备方法，该方法简单，可以实现快速、大面积制备，降低成本，具有广阔的应用前景。
Method for coating copper or copper alloy on surface of aluminum nitride ceramic
一种在氮化铝陶瓷表面敷铜或敷铜合金的方法
PAN WEI (Autor:in) / LIU GUANGHUA (Autor:in)
25.05.2021
Patent
Elektronische Ressource
Chinesisch
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