Active soldering paste composition for ceramic copper coating, ceramic copper coating method and copper-coated ceramic: Fid-Bau Portal

Active soldering paste composition for ceramic copper coating, ceramic copper coating method and copper-coated ceramic

ZHOU WEI / XU QIANG / LIU WEIWEI / WU LEI

The invention relates to an active soldering paste composition for ceramic copper coating, a method for ceramic copper coating and copper-coated ceramic, and the active soldering paste composition comprises 1-20 wt% of first metal powder, 75-94 wt% of second metal powder and the balance of soldering flux based on the total weight of the active soldering paste composition; wherein the first metal powder contains titanium hydride, and the second metal powder contains a copper-phosphorus-silver alloy. According to the active soldering paste composition, the silver content can be reduced, the welding temperature can be reduced, meanwhile, the connection strength of Ti and Cu is improved, the welding strength is improved, and materials are not prone to segregation.

本公开涉及一种用于陶瓷覆铜的活性焊膏组合物、陶瓷覆铜的方法及覆铜陶瓷，以活性焊膏组合物的总重量为基准，活性焊膏组合物含有1～20重量％的第一金属粉末、75～94重量％的第二金属粉末和余量的助焊剂；其中，第一金属粉末含有氢化钛，第二金属粉末含有铜磷银合金。本公开提供的活性焊膏组合物不仅可以降低银含量，而且可以降低焊接温度，同时还增加了Ti与Cu的连接强度，增加焊接强度，使材料不易发生偏析。

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