Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of low-temperature sintering type lead-free copper slurry for ceramic surface metallization
The invention provides a preparation method of low-temperature sintering type lead-free copper paste for ceramic surface metallization. The copper paste is composed of copper particles, a glass material and an organic carrier. The copper particles with the particle size have high sintering activity, are not prone to being oxidized at the room temperature and are beneficial to storage, before the copper particles are prepared into slurry, the copper particles are pretreated through an acid pickling method to remove oxide layers on the surfaces of the copper particles, the copper slurry is sintered at a low temperature so as to obtain a compact sintered copper film with high conductivity and high adhesive strength, and the sintered copper film can have high conductivity and adhesive strength after being sintered.
本发明提供了一种用于陶瓷表面金属化的低温烧结型无铅铜浆料的制备方法，所述铜浆料由铜颗粒、玻璃料和有机载体组成。该粒径的铜颗粒具有较高的烧结活性同时在室温下不容易被氧化，利于保存，在配成浆料之前，采用酸洗的方法，对铜颗粒进行预处理，去除其表面的氧化层，所述的铜浆料在较低温度下实现烧结进而获得致密的、高导电、高附着强度的烧结铜膜，可以在烧结之后具有较高的导电性和附着强度。
Preparation method of low-temperature sintering type lead-free copper slurry for ceramic surface metallization
The invention provides a preparation method of low-temperature sintering type lead-free copper paste for ceramic surface metallization. The copper paste is composed of copper particles, a glass material and an organic carrier. The copper particles with the particle size have high sintering activity, are not prone to being oxidized at the room temperature and are beneficial to storage, before the copper particles are prepared into slurry, the copper particles are pretreated through an acid pickling method to remove oxide layers on the surfaces of the copper particles, the copper slurry is sintered at a low temperature so as to obtain a compact sintered copper film with high conductivity and high adhesive strength, and the sintered copper film can have high conductivity and adhesive strength after being sintered.
本发明提供了一种用于陶瓷表面金属化的低温烧结型无铅铜浆料的制备方法，所述铜浆料由铜颗粒、玻璃料和有机载体组成。该粒径的铜颗粒具有较高的烧结活性同时在室温下不容易被氧化，利于保存，在配成浆料之前，采用酸洗的方法，对铜颗粒进行预处理，去除其表面的氧化层，所述的铜浆料在较低温度下实现烧结进而获得致密的、高导电、高附着强度的烧结铜膜，可以在烧结之后具有较高的导电性和附着强度。
Preparation method of low-temperature sintering type lead-free copper slurry for ceramic surface metallization
一种用于陶瓷表面金属化的低温烧结型无铅铜浆料的制备方法
LI MINGYU (Autor:in) / YANG WANCHUN (Autor:in)
08.06.2021
Patent
Elektronische Ressource
Chinesisch
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