Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Active molybdenum-silver-copper-titanium slurry for ceramic metallization packaging and preparation method of active molybdenum-silver-copper-titanium slurry
The invention discloses active molybdenum-silver-copper-titanium slurry for ceramic metallization packaging. The slurry is prepared from the following raw materials in parts by mass: 50-60 parts of molybdenum powder or molybdenum alloy powder, 20-25 parts of silver-copper-titanium alloy powder, 15-20 parts of resin, 1-2 parts of a solvent, 1-3 parts of an organic additive and 1-6 parts of an inorganic additive. Compared with the traditional active molybdenum-manganese slurry for ceramic metallization packaging, the active molybdenum-manganese slurry has the advantages that manganese-containing glass powder is replaced by a silver-copper-titanium system with higher conductivity and activity, so that the problems of low air tightness, reliability and conductivity and complicated process of brazing aluminum oxide, aluminum nitride, silicon nitride and other ceramic substrates of the molybdenum-manganese system can be effectively solved; the prepared slurry is subjected to silk-screen printing and vacuum high-temperature sintering, good combination of a ceramic device and a metal copper foil can be achieved, a formed metallization layer is tightly combined with ceramic and the copper foil, the porosity is low, the tensile strength is high, especially the expansion coefficient is low, the warping degree is low, and the high and low temperature cold and hot impact resistance is greatly improved.
本发明公开了一种陶瓷金属化封装用活性钼‑银铜钛浆料，该浆料由以下质量份配比的原料制成：50‑60份的钼粉或钼合金粉，20‑25份的银铜钛合金粉，15‑20份的树脂，1‑2份的溶剂，1‑3份的有机助剂，1‑6份的无机添加剂。相比于传统陶瓷金属化封装用活性钼锰浆料，本发明以导电性及活性更强的银铜钛体系代替含锰玻璃粉，可有效弥补钼锰体系钎焊氧化铝、氮化铝、氮化硅等陶瓷基板气密性、可靠性、导电性过低且工序繁杂的问题；将制作的浆料经过丝网印刷和真空高温烧结，可实现陶瓷器件和金属铜箔的良好结合，所形成的金属化层与陶瓷、铜箔结合紧密、孔隙率低、抗拉强度高，尤其是膨胀系数低、翘曲度低，耐高低温冷热冲击性能得到大幅提升。
Active molybdenum-silver-copper-titanium slurry for ceramic metallization packaging and preparation method of active molybdenum-silver-copper-titanium slurry
The invention discloses active molybdenum-silver-copper-titanium slurry for ceramic metallization packaging. The slurry is prepared from the following raw materials in parts by mass: 50-60 parts of molybdenum powder or molybdenum alloy powder, 20-25 parts of silver-copper-titanium alloy powder, 15-20 parts of resin, 1-2 parts of a solvent, 1-3 parts of an organic additive and 1-6 parts of an inorganic additive. Compared with the traditional active molybdenum-manganese slurry for ceramic metallization packaging, the active molybdenum-manganese slurry has the advantages that manganese-containing glass powder is replaced by a silver-copper-titanium system with higher conductivity and activity, so that the problems of low air tightness, reliability and conductivity and complicated process of brazing aluminum oxide, aluminum nitride, silicon nitride and other ceramic substrates of the molybdenum-manganese system can be effectively solved; the prepared slurry is subjected to silk-screen printing and vacuum high-temperature sintering, good combination of a ceramic device and a metal copper foil can be achieved, a formed metallization layer is tightly combined with ceramic and the copper foil, the porosity is low, the tensile strength is high, especially the expansion coefficient is low, the warping degree is low, and the high and low temperature cold and hot impact resistance is greatly improved.
本发明公开了一种陶瓷金属化封装用活性钼‑银铜钛浆料，该浆料由以下质量份配比的原料制成：50‑60份的钼粉或钼合金粉，20‑25份的银铜钛合金粉，15‑20份的树脂，1‑2份的溶剂，1‑3份的有机助剂，1‑6份的无机添加剂。相比于传统陶瓷金属化封装用活性钼锰浆料，本发明以导电性及活性更强的银铜钛体系代替含锰玻璃粉，可有效弥补钼锰体系钎焊氧化铝、氮化铝、氮化硅等陶瓷基板气密性、可靠性、导电性过低且工序繁杂的问题；将制作的浆料经过丝网印刷和真空高温烧结，可实现陶瓷器件和金属铜箔的良好结合，所形成的金属化层与陶瓷、铜箔结合紧密、孔隙率低、抗拉强度高，尤其是膨胀系数低、翘曲度低，耐高低温冷热冲击性能得到大幅提升。
Active molybdenum-silver-copper-titanium slurry for ceramic metallization packaging and preparation method of active molybdenum-silver-copper-titanium slurry
一种陶瓷金属化封装用活性钼-银铜钛浆料及其制备方法
ZHANG HONGWANG (Autor:in) / SHI WEILI (Autor:in) / LUO FUMIN (Autor:in)
25.07.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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