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BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
The invention provides a BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: step S01, preparing BN nanosheet toughened high-thermal-conductivity AlN ceramic tape casting slurry; step S02, preparing a BN nanosheet strengthened and toughened high-thermal-conductivity AlN ceramic plain sheet; and step S03, sintering the ceramic wafer prepared in the step S02 in a nitrogen atmosphere for 6-8 hours to obtain a product. Boron nitride nanosheets are stripped by adopting a mechanical ball milling method, slurry of boron nitride nanosheet strengthened and toughened aluminum nitride ceramic is prepared by adopting a one-step method, and the ceramic substrate is obtained through the processes of tape casting, glue discharging, sintering and the like. The addition of the BN nanosheets aims to greatly improve the consumption of fracture energy by the ceramic substrate through pinning and crack deflection effects of flaky nanoparticles on the basis of not influencing the heat-conducting property of the aluminum nitride substrate, so that the mechanical property of the aluminum nitride ceramic is improved, and the application field of the aluminum nitride ceramic substrate is expanded.
本发明提供了一种BN纳米片强韧化高导热AlN陶瓷基板和制备方法,包括以下步骤:步骤S01:制备BN纳米片强韧化高导热AlN陶瓷流延浆料;步骤S02:制备BN纳米片强韧化高导热AlN陶瓷素片;步骤S03:将步骤S02制得的陶瓷素片氮气气氛下烧结6‑8h,得产品。本发明采用机械球磨法剥离氮化硼纳米片,一步法制备氮化硼纳米片强韧化氮化铝陶瓷的浆料,通过流延、排胶和烧结等工艺得到陶瓷基板。BN纳米片的添加旨在不影响氮化铝基板导热性能的基础上,通过片状纳米颗粒的钉扎和裂纹偏转效应,大幅提高陶瓷基板对断裂能的消耗,从而改善氮化铝陶瓷的力学性能,扩大氮化铝陶瓷基板的应用领域。
BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
The invention provides a BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: step S01, preparing BN nanosheet toughened high-thermal-conductivity AlN ceramic tape casting slurry; step S02, preparing a BN nanosheet strengthened and toughened high-thermal-conductivity AlN ceramic plain sheet; and step S03, sintering the ceramic wafer prepared in the step S02 in a nitrogen atmosphere for 6-8 hours to obtain a product. Boron nitride nanosheets are stripped by adopting a mechanical ball milling method, slurry of boron nitride nanosheet strengthened and toughened aluminum nitride ceramic is prepared by adopting a one-step method, and the ceramic substrate is obtained through the processes of tape casting, glue discharging, sintering and the like. The addition of the BN nanosheets aims to greatly improve the consumption of fracture energy by the ceramic substrate through pinning and crack deflection effects of flaky nanoparticles on the basis of not influencing the heat-conducting property of the aluminum nitride substrate, so that the mechanical property of the aluminum nitride ceramic is improved, and the application field of the aluminum nitride ceramic substrate is expanded.
本发明提供了一种BN纳米片强韧化高导热AlN陶瓷基板和制备方法,包括以下步骤:步骤S01:制备BN纳米片强韧化高导热AlN陶瓷流延浆料;步骤S02:制备BN纳米片强韧化高导热AlN陶瓷素片;步骤S03:将步骤S02制得的陶瓷素片氮气气氛下烧结6‑8h,得产品。本发明采用机械球磨法剥离氮化硼纳米片,一步法制备氮化硼纳米片强韧化氮化铝陶瓷的浆料,通过流延、排胶和烧结等工艺得到陶瓷基板。BN纳米片的添加旨在不影响氮化铝基板导热性能的基础上,通过片状纳米颗粒的钉扎和裂纹偏转效应,大幅提高陶瓷基板对断裂能的消耗,从而改善氮化铝陶瓷的力学性能,扩大氮化铝陶瓷基板的应用领域。
BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
一种BN纳米片强韧化高导热AlN陶瓷基板和制备方法
06.08.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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