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BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
The invention provides a preparation method of a BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate. The preparation method comprises the following steps: S1, carrying out primary ball milling on boron nitride powder, polyethylene glycol, cane sugar and absolute ethyl alcohol; placing the ball-milled slurry in a cold and hot impact box for circulation for several times, and then carrying out secondary ball milling; aluminum nitride powder, yttrium oxide powder, polyvinyl butyral and absolute ethyl alcohol are added into the slurry obtained after secondary ball milling, and tape casting slurry is obtained after third-time ball milling; s2, preparing a multiphase ceramic wafer by using the tape casting slurry obtained in S1; and S3, performing high-temperature sintering on the multiphase ceramic wafer obtained in the S2 to obtain the ceramic substrate. The prepared AlN ceramic substrate is compact in structure, the relative density is larger than 99%, the heat conductivity is larger than 175 W/(m.K), the bending strength is higher than 370 MPa, the fracture toughness is higher than 5.0 MPa.m < 1/2 >, the microstructure is good, the requirement of a commercial high-heat-conductivity substrate is completely met, and the fracture toughness is far higher than that of a commercially available aluminum nitride substrate.
本发明提供一种BN纳米片强韧化高导热AlN陶瓷基板的制备方法，步骤如下：S1、对氮化硼粉体、聚乙二醇、蔗糖、无水乙醇进行一次球磨；将球磨后的浆料置于冷热冲击箱中循环若干次，随后进行二次球磨；在二次球磨后的浆料中加入氮化铝粉、氧化钇粉、聚乙烯醇缩丁醛、无水乙醇，进行三次球磨后得到流延浆料；S2、使用S1得到的流延浆料制备复相陶瓷素片；S3、对S2得到的复相陶瓷素片进行高温烧结，得到陶瓷基板。本发明制备的AlN陶瓷基板结构紧密，相对密度均大于99％，热导率均大于175W/(m·K)，抗弯强度均高于370MPa，断裂韧性高于5.0MPa·m1/2，且微观组织结构良好，完全达到了商用高导热基板的要求，断裂韧性更是远高于市售的氮化铝基板。
BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
The invention provides a preparation method of a BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate. The preparation method comprises the following steps: S1, carrying out primary ball milling on boron nitride powder, polyethylene glycol, cane sugar and absolute ethyl alcohol; placing the ball-milled slurry in a cold and hot impact box for circulation for several times, and then carrying out secondary ball milling; aluminum nitride powder, yttrium oxide powder, polyvinyl butyral and absolute ethyl alcohol are added into the slurry obtained after secondary ball milling, and tape casting slurry is obtained after third-time ball milling; s2, preparing a multiphase ceramic wafer by using the tape casting slurry obtained in S1; and S3, performing high-temperature sintering on the multiphase ceramic wafer obtained in the S2 to obtain the ceramic substrate. The prepared AlN ceramic substrate is compact in structure, the relative density is larger than 99%, the heat conductivity is larger than 175 W/(m.K), the bending strength is higher than 370 MPa, the fracture toughness is higher than 5.0 MPa.m < 1/2 >, the microstructure is good, the requirement of a commercial high-heat-conductivity substrate is completely met, and the fracture toughness is far higher than that of a commercially available aluminum nitride substrate.
本发明提供一种BN纳米片强韧化高导热AlN陶瓷基板的制备方法，步骤如下：S1、对氮化硼粉体、聚乙二醇、蔗糖、无水乙醇进行一次球磨；将球磨后的浆料置于冷热冲击箱中循环若干次，随后进行二次球磨；在二次球磨后的浆料中加入氮化铝粉、氧化钇粉、聚乙烯醇缩丁醛、无水乙醇，进行三次球磨后得到流延浆料；S2、使用S1得到的流延浆料制备复相陶瓷素片；S3、对S2得到的复相陶瓷素片进行高温烧结，得到陶瓷基板。本发明制备的AlN陶瓷基板结构紧密，相对密度均大于99％，热导率均大于175W/(m·K)，抗弯强度均高于370MPa，断裂韧性高于5.0MPa·m1/2，且微观组织结构良好，完全达到了商用高导热基板的要求，断裂韧性更是远高于市售的氮化铝基板。
BN nanosheet toughened high-thermal-conductivity AlN ceramic substrate and preparation method thereof
一种BN纳米片强韧化高导热AlN陶瓷基板和制备方法
08.07.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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