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Preparation method of heat dissipation graphite film
The invention belongs to the technical field of preparation of graphite films, and particularly relates to a preparation method of a heat dissipation graphite film, the preparation method comprises the following steps: synthesis of PI precursor polyamide acid, chemical imidization process, coating, formation of a PI fabric film and graphite film firing. The polyimide fabric film is adopted to replace a polyimide film so that the production cost of the graphite sheet is reduced without blocking by foreign PI film production technologies and equipment. By means of the coating method, PAA sizing agents with different thicknesses can be coated on the fabric to form PI + fabric + PI composite structures, a plurality of PI + fabric + PI composite structures are bonded together through the PAA sizing agents, a graphite film finished product with the thickness of 15-500 micrometers can be prepared, particularly, the graphite film with the thickness of 70-300 micrometers can still be coiled without being limited by the thickness of an existing finished product PI film. The fabric is subjected to surface modification, the interface bonding between the fabric and the base material PI film is enhanced through the modified fabric, meanwhile, the heat conductivity coefficient after self-firing is increased, and the heat-conducting property of the final graphite film is improved.
本发明属于石墨膜的制备技术领域,具体涉及一种散热石墨膜的制备方法,包括以下步骤:PI前驱体聚酰胺酸的合成、化学亚胺化过程、涂覆、形成PI织物膜及石墨膜烧制。本发明采用聚酰亚胺织物膜代替聚酰亚胺薄膜,石墨片生产成本降低,且不受国外PI膜生产技术和设备的封锁。通过本发明的涂覆方法可在织物上涂覆不同厚度的PAA浆料形成“PI+织物+PI”的复合结构,将多个“PI+织物+PI”的复合结构采用PAA浆料粘结在一起能够制备厚度为15~500μm的石墨膜成品,尤其是厚度为70~300μm的石墨膜仍可实现卷材,且不受现有成品PI膜厚度限制。本申请的织物进行表面改性,改性后的织物增强了织物与基材PI膜之间的界面结合,同时提升了自身烧制后的导热系数,增加了最终石墨膜的导热性能。
Preparation method of heat dissipation graphite film
The invention belongs to the technical field of preparation of graphite films, and particularly relates to a preparation method of a heat dissipation graphite film, the preparation method comprises the following steps: synthesis of PI precursor polyamide acid, chemical imidization process, coating, formation of a PI fabric film and graphite film firing. The polyimide fabric film is adopted to replace a polyimide film so that the production cost of the graphite sheet is reduced without blocking by foreign PI film production technologies and equipment. By means of the coating method, PAA sizing agents with different thicknesses can be coated on the fabric to form PI + fabric + PI composite structures, a plurality of PI + fabric + PI composite structures are bonded together through the PAA sizing agents, a graphite film finished product with the thickness of 15-500 micrometers can be prepared, particularly, the graphite film with the thickness of 70-300 micrometers can still be coiled without being limited by the thickness of an existing finished product PI film. The fabric is subjected to surface modification, the interface bonding between the fabric and the base material PI film is enhanced through the modified fabric, meanwhile, the heat conductivity coefficient after self-firing is increased, and the heat-conducting property of the final graphite film is improved.
本发明属于石墨膜的制备技术领域,具体涉及一种散热石墨膜的制备方法,包括以下步骤:PI前驱体聚酰胺酸的合成、化学亚胺化过程、涂覆、形成PI织物膜及石墨膜烧制。本发明采用聚酰亚胺织物膜代替聚酰亚胺薄膜,石墨片生产成本降低,且不受国外PI膜生产技术和设备的封锁。通过本发明的涂覆方法可在织物上涂覆不同厚度的PAA浆料形成“PI+织物+PI”的复合结构,将多个“PI+织物+PI”的复合结构采用PAA浆料粘结在一起能够制备厚度为15~500μm的石墨膜成品,尤其是厚度为70~300μm的石墨膜仍可实现卷材,且不受现有成品PI膜厚度限制。本申请的织物进行表面改性,改性后的织物增强了织物与基材PI膜之间的界面结合,同时提升了自身烧制后的导热系数,增加了最终石墨膜的导热性能。
Preparation method of heat dissipation graphite film
一种散热石墨膜的制备方法
CHEN QU (Autor:in) / TANG WENJUN (Autor:in) / YANG ZHAOHUI (Autor:in) / WU XIAONING (Autor:in) / ZHU GUANGFU (Autor:in)
24.08.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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