Preparation method of gradient-type self-heat-preservation fabricated wallboard and wallboard prepared through preparation method: Fid-Bau Portal

Preparation method of gradient-type self-heat-preservation fabricated wallboard and wallboard prepared through preparation method

ZHANG XIANYUAN / ZHU WEN / WU JIANG / CHEN JINDONG / HUANG SHIMING

Abstract

The invention belongs to the technical field of building materials, and particularly relates to a preparation method of a gradient-type self-heat-preservation fabricated wallboard and the wallboard prepared through the preparation method. The preparation method comprises the following steps: (1) preparation of slurry: mixing cement, ground fine sand, fly ash, silica fume, fibers and other raw materials to prepare slurry, and adjusting the content of each raw material to obtain first slurry, ..., and N

slurry (wherein N is more than or equal to 2 and less than or equal to 3); (2) preparation of foam; (3) material mixing: mixing a plurality of parts of the slurry with the foam in proportion according to the number of pouring layers to obtain a plurality of parts of mixed slurry, wherein a volume ratio of the foam to the slurry is a foam-slurry ratio which is in a range of 0-20; (4) layered pouring; and (5) demolding and curing. According to the method, the slurry proportion is adjusted in a segmented mode, the foam-slurry ratio is adjusted in a layered mode, and layer-by-layer pouring is conducted in the thickness direction of the wallboard, so gradual change of the heat preservation and heat insulation performance of the wallboard in the thickness direction is achieved, interface connection problems are avoided, and the influence of temperature stress concentration is avoided or reduced.

本发明属于建筑材料技术领域，具体涉及一种渐变式自保温装配式墙板的制备方法及其制备的墙板。所述制备方法包括以下步骤：(1)配制料浆：将水泥、磨细砂、粉煤灰、硅灰、纤维搅拌等原料混合制得料浆，通过调节各原料含量获得第一料浆、……、第N料浆，2≤N≤3。(2)制备泡沫；(3)混料：按浇注层数将若干份所述料浆分别与所述泡沫按比例混合，得到若干份混合料浆，泡沫与料浆的体积比为泡浆比，所述泡浆比为0‑20；(4)分层浇注；(5)脱模养护。本发明采用分段调整料浆配比、分层调整泡浆比，在墙板厚度方向逐层浇注，实现了墙板在厚度方向保温隔热性能的渐变，无界面连接问题，避免或降低了温度应力集中影响。

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