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Shell, preparation method thereof and electronic equipment
The invention provides a shell, and the shell comprises a polymer ceramic layer, wherein the polymer ceramic layer comprises ceramic particles and a polymer, the surface of each ceramic particle is provided with a sunken structure, and the sunken structures are filled with the polymer. The surfaces of the ceramic particles in the shell are provided with the concave structures, the concave structures are filled with the polymer, the contact area between the ceramic particles and the polymer is increased, the interface adhesion performance of the ceramic particles and the polymer is improved, then the mechanical property of the shell is improved, the shell has the ceramic texture, and application of the shell is better facilitated. The invention further provides a preparation method of the shell and electronic equipment.
本申请提供了一种壳体,所述壳体包括聚合物陶瓷层,所述聚合物陶瓷层包括陶瓷颗粒和聚合物,所述陶瓷颗粒的表面具有凹陷结构,所述聚合物填充所述凹陷结构。该壳体中的陶瓷颗粒表面具有凹陷结构,聚合物填充凹陷结构,有利于增加陶瓷颗粒与聚合物之间的接触面积,提高陶瓷颗粒与聚合物的界面粘附性能,进而有利于提高壳体的力学性能,并且壳体具有陶瓷质感,更有利于壳体的应用。本申请还提供了壳体的制备方法和电子设备。
Shell, preparation method thereof and electronic equipment
The invention provides a shell, and the shell comprises a polymer ceramic layer, wherein the polymer ceramic layer comprises ceramic particles and a polymer, the surface of each ceramic particle is provided with a sunken structure, and the sunken structures are filled with the polymer. The surfaces of the ceramic particles in the shell are provided with the concave structures, the concave structures are filled with the polymer, the contact area between the ceramic particles and the polymer is increased, the interface adhesion performance of the ceramic particles and the polymer is improved, then the mechanical property of the shell is improved, the shell has the ceramic texture, and application of the shell is better facilitated. The invention further provides a preparation method of the shell and electronic equipment.
本申请提供了一种壳体,所述壳体包括聚合物陶瓷层,所述聚合物陶瓷层包括陶瓷颗粒和聚合物,所述陶瓷颗粒的表面具有凹陷结构,所述聚合物填充所述凹陷结构。该壳体中的陶瓷颗粒表面具有凹陷结构,聚合物填充凹陷结构,有利于增加陶瓷颗粒与聚合物之间的接触面积,提高陶瓷颗粒与聚合物的界面粘附性能,进而有利于提高壳体的力学性能,并且壳体具有陶瓷质感,更有利于壳体的应用。本申请还提供了壳体的制备方法和电子设备。
Shell, preparation method thereof and electronic equipment
壳体及其制备方法和电子设备
CHEN YIJUN (Autor:in) / HU MENG (Autor:in) / LI CONG (Autor:in)
15.10.2021
Patent
Elektronische Ressource
Chinesisch
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