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FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
Provided are: a filler that is blended in a resin such as a plastic, a curable resin, or a rubber to obtain a resin composition, and that can increase the heat conductivity of a molded body of the resin composition; a molded body; and a heat dissipating material having a high heat conductivity. A resin composition containing a filler and a resin is molded into a molded body, and a heat dissipating material is obtained from this molded body. The filler is constituted of secondary particles which are a sintered body of a powder containing primary particles of a ceramic. The filler has a specific surface area of 0.25 m<2>/g or less as measured by the BET method, and has a granule strength of 45 MPa or more as measured by a micro-compression test.
提供:配混在塑料、固化性树脂、橡胶等树脂中,能够提高得到的树脂组合物的成形体的热导率的填料、以及热导率高的成形体及散热材料。对含有填料和树脂的树脂组合物进行成形而制成成形体,由该成形体得到散热材料。填料由二次颗粒形成,所述二次颗粒为含有陶瓷的一次颗粒的粉末的烧结体。并且,填料的通过BET法测定的比表面积为0.25m2/g以下,通过微压缩试验测定的颗粒强度为45MPa以上。
FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
Provided are: a filler that is blended in a resin such as a plastic, a curable resin, or a rubber to obtain a resin composition, and that can increase the heat conductivity of a molded body of the resin composition; a molded body; and a heat dissipating material having a high heat conductivity. A resin composition containing a filler and a resin is molded into a molded body, and a heat dissipating material is obtained from this molded body. The filler is constituted of secondary particles which are a sintered body of a powder containing primary particles of a ceramic. The filler has a specific surface area of 0.25 m<2>/g or less as measured by the BET method, and has a granule strength of 45 MPa or more as measured by a micro-compression test.
提供:配混在塑料、固化性树脂、橡胶等树脂中,能够提高得到的树脂组合物的成形体的热导率的填料、以及热导率高的成形体及散热材料。对含有填料和树脂的树脂组合物进行成形而制成成形体,由该成形体得到散热材料。填料由二次颗粒形成,所述二次颗粒为含有陶瓷的一次颗粒的粉末的烧结体。并且,填料的通过BET法测定的比表面积为0.25m2/g以下,通过微压缩试验测定的颗粒强度为45MPa以上。
FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
填料、成形体及散热材料
USHIDA NAOKI (Autor:in) / MASUDA YUJI (Autor:in) / SATO MINA (Autor:in) / SATO KAZUTO (Autor:in) / ISAYAMA TAKUYA (Autor:in)
19.11.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR