Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.
FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.
FILLER, MOLDED BODY, HEAT DISSIPATING MATERIAL
FÜLLKÖRPER, FORMKÖRPER, WÄRMEABLEITENDES MATERIAL
CHARGE, CORPS MOULÉ, MATÉRIAU DE DISSIPATION DE CHALEUR
USHIDA NAOKI (Autor:in) / MASUDA YUJI (Autor:in) / SATO MINA (Autor:in) / SATO KAZUTO (Autor:in) / ISAYAMA TAKUYA (Autor:in)
05.10.2022
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR