Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic substrate AlN/Ti layered composite material and preparation method and application thereof
The invention discloses a ceramic substrate AlN/Ti layered composite material and a preparation method and application thereof, and belongs to the technical field of ceramic/metal composite materials. The AlN/Ti layered composite material disclosed by the invention is obtained by diffusion bonding of an aluminum nitride ceramic substrate and titanium through a sintering reaction. A diffusion region formed by a composite interface of reaction combination comprises two or more than two compound structures of Ti3Al2N2, Ti3AlN, TiN1-x and Al2Ti. The invention further provides a preparation method and application of the composite material. The interface structure of the AlN/Ti layered composite material of the ceramic substrate can adjust the stress between the ceramic substrate and the metal layer caused by the difference of thermal expansion coefficients of metal and ceramic to the greatest extent, so that the bonding strength of the ceramic substrate and the subsequent metal copper layer is enhanced, the reliability of the whole packaging module in the thermal cycle period is improved, and the conductivity is beneficial to welding of subsequent metal layers; and the process is simple, and the cost is low.
一种陶瓷基板AlN/Ti层状复合材料及其制备方法和应用，属于陶瓷/金属复合材料技术领域。本发明所述的AlN/Ti层状复合材料是通过氮化铝陶瓷基板与钛通过烧结反应扩散结合得到的。反应结合的复合界面形成的扩散区域包含Ti3Al2N2、Ti3AlN、TiN1‑x、Al2Ti中的两种或两种以上化合物组织。还提供了该复合材料的制备方法和应用。本发明陶瓷基板AlN/Ti层状复合材料的界面结构能最大程度地调节陶瓷基板与金属层之间由于金属与陶瓷的热膨胀系数差异导致的应力，从而增强陶瓷基板与后续的金属铜层的结合强度，提高整个封装模块在热循环期间的可靠性，其导电性有利于后续金属层的焊接，并且工艺简单，成本低。
Ceramic substrate AlN/Ti layered composite material and preparation method and application thereof
The invention discloses a ceramic substrate AlN/Ti layered composite material and a preparation method and application thereof, and belongs to the technical field of ceramic/metal composite materials. The AlN/Ti layered composite material disclosed by the invention is obtained by diffusion bonding of an aluminum nitride ceramic substrate and titanium through a sintering reaction. A diffusion region formed by a composite interface of reaction combination comprises two or more than two compound structures of Ti3Al2N2, Ti3AlN, TiN1-x and Al2Ti. The invention further provides a preparation method and application of the composite material. The interface structure of the AlN/Ti layered composite material of the ceramic substrate can adjust the stress between the ceramic substrate and the metal layer caused by the difference of thermal expansion coefficients of metal and ceramic to the greatest extent, so that the bonding strength of the ceramic substrate and the subsequent metal copper layer is enhanced, the reliability of the whole packaging module in the thermal cycle period is improved, and the conductivity is beneficial to welding of subsequent metal layers; and the process is simple, and the cost is low.
一种陶瓷基板AlN/Ti层状复合材料及其制备方法和应用，属于陶瓷/金属复合材料技术领域。本发明所述的AlN/Ti层状复合材料是通过氮化铝陶瓷基板与钛通过烧结反应扩散结合得到的。反应结合的复合界面形成的扩散区域包含Ti3Al2N2、Ti3AlN、TiN1‑x、Al2Ti中的两种或两种以上化合物组织。还提供了该复合材料的制备方法和应用。本发明陶瓷基板AlN/Ti层状复合材料的界面结构能最大程度地调节陶瓷基板与金属层之间由于金属与陶瓷的热膨胀系数差异导致的应力，从而增强陶瓷基板与后续的金属铜层的结合强度，提高整个封装模块在热循环期间的可靠性，其导电性有利于后续金属层的焊接，并且工艺简单，成本低。
Ceramic substrate AlN/Ti layered composite material and preparation method and application thereof
一种陶瓷基板AlN/Ti层状复合材料及其制备方法和应用
WANG MINGZHI (Autor:in) / NING YANGJIN (Autor:in) / ZHAO YUCHENG (Autor:in) / ZOU QIN (Autor:in) / LIU SHUTONG (Autor:in) / ZHAI XINXUAN (Autor:in) / LU KUIHU (Autor:in)
21.01.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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