Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Diamond-silicon carbide composite material, preparation method and electronic equipment
According to the diamond-silicon carbide composite material, the preparation method and the electronic equipment provided by the embodiment of the invention, the diamond powder and the silicon carbide powder are mixed with the gel premix, then wet ball milling is carried out to prepare the slurry, the mass ratio of the diamond powder to the silicon carbide powder is (10-80): (20-90), the slurry is injected into a mold for molding, and after drying and degreasing, the diamond-silicon carbide composite material is obtained. A diamond-silicon carbide prefabricated blank is obtained, liquid silicon is infiltrated into the prefabricated blank in a non-pressure mode in a vacuum environment, a compact diamond-silicon carbide sintered body is obtained, and silicon is high-purity silicon powder or silicon blocks. While the densified composite material is effectively prepared, the infiltration temperature of the liquid silicon is strictly controlled, and the negative influence caused by diamond graphitization is effectively avoided. The composite material has the advantages of high thermal conductivity, low expansion, low density, wear resistance and the like, and is an ideal thermal management application material.
本发明实施例中提供的金刚石‑碳化硅复合材料、制备方法及电子设备，将金刚石粉和碳化硅粉与凝胶预混夜混合后湿法球磨，制备浆料，其中金刚石粉与碳化硅粉质量比为(10～80)：(20～90)，将浆料注入模具成型，干燥和脱脂后，得到金刚石‑碳化硅预制坯体，预制坯体在真空环境下无压浸渗液态硅，得到致密的金刚石‑碳化硅烧结体，其中硅为高纯度硅粉或硅块。在有效制备致密化复合材料的同时，严格控制液体硅浸渗温度，有效避免了金刚石石墨化所带来的负面影响。这种复合材料具有高导热，低膨胀，低密度和耐磨损等优点，是一种理想的热管理应用材料。
Diamond-silicon carbide composite material, preparation method and electronic equipment
According to the diamond-silicon carbide composite material, the preparation method and the electronic equipment provided by the embodiment of the invention, the diamond powder and the silicon carbide powder are mixed with the gel premix, then wet ball milling is carried out to prepare the slurry, the mass ratio of the diamond powder to the silicon carbide powder is (10-80): (20-90), the slurry is injected into a mold for molding, and after drying and degreasing, the diamond-silicon carbide composite material is obtained. A diamond-silicon carbide prefabricated blank is obtained, liquid silicon is infiltrated into the prefabricated blank in a non-pressure mode in a vacuum environment, a compact diamond-silicon carbide sintered body is obtained, and silicon is high-purity silicon powder or silicon blocks. While the densified composite material is effectively prepared, the infiltration temperature of the liquid silicon is strictly controlled, and the negative influence caused by diamond graphitization is effectively avoided. The composite material has the advantages of high thermal conductivity, low expansion, low density, wear resistance and the like, and is an ideal thermal management application material.
本发明实施例中提供的金刚石‑碳化硅复合材料、制备方法及电子设备，将金刚石粉和碳化硅粉与凝胶预混夜混合后湿法球磨，制备浆料，其中金刚石粉与碳化硅粉质量比为(10～80)：(20～90)，将浆料注入模具成型，干燥和脱脂后，得到金刚石‑碳化硅预制坯体，预制坯体在真空环境下无压浸渗液态硅，得到致密的金刚石‑碳化硅烧结体，其中硅为高纯度硅粉或硅块。在有效制备致密化复合材料的同时，严格控制液体硅浸渗温度，有效避免了金刚石石墨化所带来的负面影响。这种复合材料具有高导热，低膨胀，低密度和耐磨损等优点，是一种理想的热管理应用材料。
Diamond-silicon carbide composite material, preparation method and electronic equipment
一种金刚石-碳化硅复合材料、制备方法以及电子设备
ZHU WANLI (Autor:in) / BAO JIANXUN (Autor:in) / ZHANG GE (Autor:in) / CUI CONGCONG (Autor:in) / XU CHUANXIANG (Autor:in)
11.03.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
Diamond-silicon carbide composite material, preparation method thereof and electronic equipment
| Europäisches Patentamt | 2020
Diamond-silicon carbide composite material, preparation method thereof and electronic equipment
| Europäisches Patentamt | 2020
Diamond/silicon carbide ceramic composite material and preparation method thereof
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2024
Diamond-silicon carbide composite ceramic and preparation method thereof
| Europäisches Patentamt | 2022